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Call For Abstracts

Call For Abstracts

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Share Your Insights and Expertise at Flex 2019: Building Outside the Box 

NOTE: You will receive notification by Friday, Nov. 2 if your abstract has been accepted into the program. 

Flexible Hybrid Electronics (FHE) are high-performance, integrated devices. Curved and variable in form factor, they augment day-to-day life with diverse applications, enabling us to interact with our surroundings like no personal computing devices have ever before.

As new methods for creating them emerge, business and supply chain paradigms are increasingly challenged. That’s what Building Outside the Box is all about: Speakers will highlight the latest technology breakthroughs and business strategies, and provide informative demonstrations of flexible hybrid and printed electronics products, equipment, and materials, as well as the unique electronics applications they enable.

The FLEX 2019 conference provides a great opportunity to highlight your expertise before hundreds of professionals from across the industry’s extended value chain. Please consider giving a presentation on your personal contribution to FHE innovation and the impact it is having on the future of electronics.

SHARE YOUR KNOWLEDGE WITH A TARGETED AUDIENCE

  • 700+ executives, product marketing managers, business development professionals, researchers, and engineers from the flexible, hybrid, and printed electronics value chain
  • 400 companies, universities, R&D labs, and government agencies
  • Leading industry analysts and media — from around the world

BENEFITS OF PRESENTING

  • Recognition as a leader in our exciting, market-disrupting field of electronics
  • Acknowledgment on the website and FLEX proceedings
  • Discounted registration fee
  • TechTALK speakers have the opportunity to demonstrate their product in the Exhibit Hall theater
 

 

Submit an Abstract

You may choose to submit an abstract for the following: 

  • Oral presentation
  • TechTALK demo in the Exhibit Hall theater
  • Poster for the Student Poster Session

Complete the ONLINE FORM and upload an abstract of 100-250 words describing your topic and how it applies to flexible, hybrid, and printed electronics products. There is no fee for submission. SEMI FlexTech Group members will receive priority consideration. Preference will be given to:

  • Original research and advancements in process and materials
  • End-users; potential end-users
  • Presenters who commit to participating in a product or material demonstration at TechTALKS in the Exhibit Hall theater.  

 

Topic Areas

APPLICATION MARKET SEGMENTS & IOT

  • Agriculture
  • Consumer Electronics and Agriculture
  • Consumer Electronics: Appliances, Wearables & Textiles
  • Smart Infrastructure: Buildings, Surfaces & Lighting
  • Smart Manufacturing
  • Smart MedTech: Health and Wellness & Human Performance Monitoring
  • Smart Transportation: Automotive, Aircraft & Public Transit

FLEXIBLE ELECTRICAL COMPONENTS

  • Advanced Packaging
  • Batteries & Energy Sources
  • Flexible Displays
  • Lighting
  • Other Hybrid Devices
  • Sensors
  • TFTs, Memory & Logic
  • User Interface

MATERIALS

  • Barrier Films
  • Conductors, Insulators & Semiconductors
  • Electronic Fibers & Fabrics
  • Functional Inks
  • ITO & ITO Replacements
  • Substrates & Substrate Treatments

PROCESSES AND MANUFACTURING

  • Equipment & Metrology
  • Failure & Lifetime Reliability
  • Hybrid Printing Processes
  • Integrated Manufacturing
  • Integration of Hybrid Devices
  • Multi-layer Additive Printing
  • Roll to Roll & Web Processing
  • System Interconnects
  • Testing

STANDARDS

  • Design & Modeling File Format
  • Processes & Manufacturing
  • Reliability & Qualifications

 

Presentation and Submission Guidelines 

Presentations must include practical recommendations for addressing commercialization issues. Preference will be given to applications providing innovative technological or market solutions driven by a particular use-case along with its integration challenges and system-level architecture decisions. Applications should feature unique requirements such as power efficiency, computational capabilities, wireless interconnectivity, and data management. Presentations should cover how each challenge was addressed and overcome.

  • Abstracts should clearly outline a path forward and articulate a call-to-action.
  • Commercial or marketing presentations will not be accepted.
  • Speakers will receive discounted admission to FLEX 2019. No other compensation will be provided.
  • Speakers will be required to sign an agreement, provide a bio and headshot by October 26, and provide an electronic copy of his or her presentation by February 6, 2019.
  • All final presentations will be made available to conference attendees and FLEX members.

Key Dates

  • NEW Submission Deadline for Abstracts: September 28, 2018
  • Notification of Acceptance: October 19, 2018
  • Final Presentation Due for Review: February 6, 2019

Contact

Michelle Fabiano: mfabiano@semi.org

 

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