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CALL FOR ABSTRACTS

CALL FOR ABSTRACTS

 

 

SEE THE FUTURE WITH 20/20 VISION

 

IMPORTANT DATES

  • Final Presentation Due for Review: Monday, February 3, 2020

SEMI, the FlexTech Group, and the FLEX 2020 Executive Committee invite you to submit an abstract for one or more of the following areas:

  • TechTALKS Demonstration and Presentation

  • Student Poster Display and Competition

The FLEX 2020 theme is “See the Future with 20/20 Vision.”  Flexible hybrid electronics represents high performance integrated devices that are curved and variable in form factor. Electronics that augment our daily activities and interact with our surroundings like no personal computing device ever has are emerging in new and varied application spaces. And as methods to design and build these devices are developed, business and supply chain paradigms are challenged. Building outside the box requires thinking outside the box.

BENEFITS 

  • Be recognized as a leader in our exciting and market-disrupting field of flexible electronics.
  • Selected presenters receive acknowledgment in the onsite FLEX | MSTC 2020 Event Guide, the conference website, and FLEX proceedings and a discounted FLEX registration fee. 
  • TechTALK presenters have the opportunity to demonstrate their product or material on the show floor stage. 

ORAL PRESENTATIONS AND TECH TALKS

Speakers will highlight the latest technical breakthroughs, unique electronics applications, and business strategies. This FHE go-to event is the center of technical and informative demonstration of flexible hybrid and printed electronics products, equipment, processes and materials and the applications they enable. We are inviting speakers from across the electronics supply chain to present on FHE innovation and the impact it is having on the future of electronic products.

As the premier information-gathering and networking conference for industry stakeholders, FLEX along with MSTC gathers 600+ executives, product managers, business development professionals, and engineering directors from the flexible, hybrid and printed electronics value chain, as well as a multitude of leading industry analysts and media. The event attracts over 400 companies, universities, R&D labs, and government agencies from around the world. This year’s conference will take place Monday-Thursday, February 24-28, 2019 at the Doubletree Hotel in San Jose, California.

STUDENT POSTERS 

Students from leading research universities are especially welcome to submit posters describing their work and results on the same target topics. Prizes will be awarded to the top three student posters as judged by a panel of industry and academic experts. The author/co-author must be available to present during the poster judging times during the conference.

    SUBMIT YOUR FLEX ABSTRACT HERE—ONLINE FORM

    Complete the online form and upload your abstract (100-300 words) describing the topic of your presentation and how it applies to the flexible, hybrid and printed electronics products. There is no fee for submission. SEMI - FlexTech Group members will receive priority consideration.

    Preference will be given to:

    • Original research and advancements in process and materials
    • End-users, potential end-users
    • Presentations who commit to a product or material demonstrations in the TechTALK arena on the show floor.

    TOPIC AREAS 

    We are seeking abstracts addressing flexible, hybrid and printed electronics breakthroughs and innovations in, but not limited to, the following:

    MANUFACTURING

    Flexible Hybrid Electronics encompasses systems produced with combinations of printing processes, discrete components, and traditional or thinned integrated circuits, and relies on both well-established and emerging manufacturing processes.  This program track seeks abstracts in the broad category of FHE manufacturing.  Of interest are printing as a path to digital manufacturing, deposition processes for conductors and dielectrics, scalable manufacturing methods for large-area and high-volume applications, and manufacturing cost modeling.  Talks within this category may also address unique capabilities and challenges, such as trusted FHE manufacturing, data security, and anti-counterfeit.  Device and system-level testing and test methodologies for performance and reliability topics are also appropriate.

    • Printing as a path to digital manufacturing
    • Deposition processes for conductors and insulators
    • Scale-able manufacturing for a large area, large volume
    • Manufacturing cost modeling
    • Trusted FHE manufacturing – anti-counterfeit, data security
    • Testing

    ADVANCED MATERIALS

    All aspects for the development of novel FHE materials, including conductors, dielectrics, semiconductors, functional inks, barrier coatings, and adhesives, which are applied by coating, printing, unique deposition, or roll-to-roll techniques are sought. In addition, development of new substrate type materials, including barrier films, flexible substrates, substrate treatments, and surface mount and die-attach materials are also of interest. Including new materials that are flexible, bendable, foldable, rollable, or are enabling to FHE are also welcome.

    • Conductive materials
    • Materials for surface mount and die attach
    • Additive process materials for high temperature
    • Substrates and substrate treatments
    • Conductors, insulators, semiconductors
    • Functional inks
    • Electronics fibers and fabrics
    • Barrier films
    • Dielectrics

    DESIGN 

    Although the principal approach to FHE design is like that of rigid boards, there are several key requirements that are FHE-specific. In order to achieve tight bend radii, design rules need to provide for mechanical properties while doing the electrical design.  Dedicated bend areas may be incorporated to allow the electrical layout to accommodate mechanical requirements for system bending and flexing while protecting sensitive circuit elements. Additive processing techniques call for a different material set compared to conventional subtractive processing. For wireless applications and high-speed designs, design rules should accommodate these materials parameters. Finally, die integration versus the use of packaged components is a key enabler of flexible hybrid electronics that provides for co-designs of chip and board to optimize the overall system performance.

    This program track seeks abstracts focused on the current state of the art in FHE system design that will showcase topics for electrical layout considering mechanical bend, flex or stretch requirements, design tools that enable co-designs of ICs directly integrated into board layouts, and reference designs for FHE sensor systems for printed or component integrated sensing elements.

    • Geometric and electronic design rules
    • EDA tools that enable concurrent co-design (system, SW/HW)
    • Reference designs for FHE sensor systems

    SENSOR INTEGRATION

    Integration of sensor systems on FHE platforms is critically important for novel sensing applications enabling greater ease of use, lower cost and added functionality. Installation of sensors conformally in/or mechanically bendable, stretchable, irregular, flexible and constantly moving surfaces or objects (fabrics, polymers) needs innovative developments in integration technique, sensor, and platform design, sensor-substrate compatibility, reliability, production capability and functionality. Seamless integration of active and passive sensor components and systems in flexible platforms for applications in wearables, e-textiles, environmental gas sensing, asset monitoring, healthcare (e.g. human biochemistry sensing, cuff-less blood pressure sensing), automotive, IoT and smart packaging. Abstracts are welcome which attempts to address the challenges and discuss the opportunities of integrating sensors on FHE platforms, from materials, components, systems, design, performance, reliability, fabrication and production point of view. 

    • Flexible sensors
    • MEMS integration
    • Sensing systems and integration
    • Environmental sensing for extreme environments
    • Human biochemistry sensing
    • Cuffless blood pressure sensing

    APPLICATIONS

    A broad range of application topics is covered with the goal of aligning FHE development with market needs. Application areas include Consumer Electronics (such as smart home devices, robotics), Smart Infrastructure (buildings, surfaces, solar, energy storage), Smart Transportation (such as automotive, aerospace, marine), Connectivity (including RF, microwave, antennae, phased arrays, 5G, IoT), Medical (Health, Wellness, monitoring), Sensors and System Integration, Displays and Display Integration. In addition to submissions for FHE technical development, end-user companies who have unmet requirements for FHE will also be of interest.

    • Structural health monitoring
    • Medical, health, and wellness
    • Display
    • Smart transportation: Aerospace, Automotive, Marine
    • RF, microwave, antenna and phased arrays
    • Connectivity, 5G, IoT
    • Smart infrastructure: Buildings, Surfaces, Lighting, Solar, Energy Storage
    • Sensor system integration; agriculture and environment
    • Consumer electronics

    SYSTEM COMPONENTS 

    FHE systems rely on many types of placed and in-process fabricated components. This program track seeks abstracts focused on the development, fabrication, application, and testing of components used in FHE systems. Examples of topics include energy storage devices, interconnects, connectors, printed or placed passive components, integrated circuits for flexible electronics, human-machine interface elements, microfluidics.  Abstracts should focus on developments specific to flexible electronics, as opposed to general advances in the field.

    • Energy storage, supercapacitors
    • Human-machine interface elements
    • Micro-fluidics
    • Passives
    • Interconnect
    • Connectors
    • Integrated circuits for flexible electronics

    PRESENTATION and SUBMISSION GUIDELINES 

    Presentations must include:

    • Practical recommendations for addressing commercialization issues or applications providing innovative technological or market solutions driven by a use-case along with its integration challenges and system-level architecture decisions.
    • How each challenge was addressed and overcome. 
    • Main message you wish to convey, your recommendations for the supply chain and how your presentation, demonstration or poster will advance the technology of FHE, PE or FE and/or manufacturing methods. 
    • Suggestions on how SEMI and the FlexTech Group can assist the progress on your issues or recommendations. 
    • Address why and to whom the technology presented matters.
    • Clear outlined a path forward and articulate a call-to-action.
    • NO Commercial or marketing presentations will be accepted.

    Accepted Abstracts 

    • Speakers receive discounted admission to FLEX Conference 2020. No other compensation is provided.
    • Speakers are required to sign a Speaker Agreement, provide a bio and headshot by December 1, 2019, and provide an electronic copy of his or her presentation by February 3, 2020.
    • All final presentations are made available to conference attendees and SEMI / FlexTech members.

     

    QUESTIONS?
    Michelle Fabiano, IOM
    Program & Event Manager, SEMI
    mfabiano@semi.org

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