Share Your Insights and Expertise at Flex 2019: Building Outside the Box
Submission Date Extended to Friday, September 28, 2018
Flexible Hybrid Electronics (FHE) are high-performance, integrated devices. Curved and variable in form factor, they augment day-to-day life with diverse applications, enabling us to interact with our surroundings like no personal computing devices have ever before.
As new methods for creating them emerge, business and supply chain paradigms are increasingly challenged. That’s what Building Outside the Box is all about: Speakers will highlight the latest technology breakthroughs and business strategies, and provide informative demonstrations of flexible hybrid and printed electronics products, equipment, and materials, as well as the unique electronics applications they enable.
The FLEX 2019 conference provides a great opportunity to highlight your expertise before hundreds of professionals from across the industry’s extended value chain. Please consider giving a presentation on your personal contribution to FHE innovation and the impact it is having on the future of electronics.
SHARE YOUR KNOWLEDGE WITH A TARGETED AUDIENCE
BENEFITS OF PRESENTING
Submit an Abstract
You may choose to submit an abstract for the following:
Complete the ONLINE FORM and upload an abstract of 100-250 words describing your topic and how it applies to flexible, hybrid, and printed electronics products. There is no fee for submission. SEMI FlexTech Group members will receive priority consideration. Preference will be given to:
APPLICATION MARKET SEGMENTS & IOT
FLEXIBLE ELECTRICAL COMPONENTS
PROCESSES AND MANUFACTURING
Presentation and Submission Guidelines
Presentations must include practical recommendations for addressing commercialization issues. Preference will be given to applications providing innovative technological or market solutions driven by a particular use-case along with its integration challenges and system-level architecture decisions. Applications should feature unique requirements such as power efficiency, computational capabilities, wireless interconnectivity, and data management. Presentations should cover how each challenge was addressed and overcome.
Michelle Fabiano: firstname.lastname@example.org