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COMMITTEES & COUNCILS

COMMITTEES & COUNCILS

MEMS & Sensors Technical Congress Speaker Selection Committee

  • Michael A. Helmbrecht, PhD, AM Fitzgerald 
  • Tony Zarola, Analog Devices (ADI)  
  • Andre Rouzaud, PhD, CEA-Léti 
  • Nicole Kerness 
  • Evgeni Gousev, PhD, Qualcomm Technologies 
  • Uma Krishnamoorthy 
  • Thomas Kenny, PhD, Stanford University 
  • Mahesh Chowdhary, PhD, STMicroelectronics 
  • ​Tia Williams, Texas Instruments 

FLEX 2019 Executive Committee

  • Bob Praino, Chasm Advanced Materials, CHAIR
  • Neil Morrison, Applied Materials
  • Mark Poliks, Binghamton University
  • Doyle Edwards, Brewer Science
  • Robert Reuss, Chemistry & Electronics Technology
  • Scott Gordon, DuPont Teijin Films
  • Michael D. McCreary, PhD, E Ink 
  • Paul Cain, FlexEnable
  • Yu Xia, Flexterra
  • Erica Montbach, Kent Displays 
  • Pavel Dutta, Lumileds 
  • Stephen Farias, NanoDirect
  • Scott Miller, NextFlex 
  • ​Kei Hyodo, Yuasa System Co. 

FlexTech Governing Council

  • Daniel P. Forster, Applied Materials
  • Eric Forsythe, Army Research Lab                         
  • Ilaria Grizzi, PhD, Cambridge Display Technology
  • Robert Praino, Chasm Advanced Materials         
  • Scott E. Gordon, DuPont Teijin Films    
  • Michael D. McCreary, PhD, E Ink
  • Robert S. Miller, EMD Performance Materials (Merck KGaA)
  • Melissa Grupen-Shemansky, FlexTech, SEMI
  • Mike Deppe, Molex
  • Malcom Thompson, PhD, NextFlex                        
  • Evgeni Gousev, Qualcomm
  • Ajit Manocha, SEMI
  • Rich Salsman, SEMI
  • Arvind Kamath, ThinFilm Electronics

MSIG Governing Council

  • John Chong, JIB Technology, CHAIR 
  • Becky Oh, PNI Sensor
  • Kevin Crofton, SPTS
  • Evgeni Gousev, Qualcomm (term ends December 2019) 
  • Jeff Hilbert, 2 The Point Advisors
  • David Kirsch, EV Group
  • Dave Monk, NXP
  • Charles Yang, SITRI
  • Roland Helm, Infineon
  • Mary Ann Maher, SoftMEMS
  • Todd Miller, GE Global Research
  • Andre Rouzaud, CEA Leti
  • Benedetto Vigna, STMicroelectronics (joining 2020) 
  • Claude Jean, Teledyne DALSA (joining 2020)    
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