• FLEXI Product Innovation AwardAmerican Semiconductor for the innovative product design of FleX NFC, the industry’s first flexible IC to support NFC communication and new ways to connect to the Internet of Things (IoT).
  • R&D Achievements Award - FlexEnable developed the world’s first industrially-proven, low-cost flexible transistor technology, allowing displays to be built on plastic.
  • Industry Leadership - Keith Rollins, formerly with DuPont Teijin Films, won a FLEXI for his dedication and work to commercialize flexible electronics materials. Rollins served as volunteer chair of the UK Plastic Electronics Leadership Group and a member and chair of the SEMI-FlexTech Governing Council.
  • Technology Champion and Leadership in Education Award - Mark Poliks, Empire Innovation Professor of Engineering and Director of the Center for Advanced Microelectronics Manufacturing at Binghamton University, won a FLEXI for advancing flexible and printed electronics and for his contributions to the FLEX conference including participating in Calls for Abstracts, leading a Tech Course, and serving on every SEMI-FlexTech committee.


  • FLEXI Product Innovation Award - E Ink for Dazzle, the world's largest electronic paper installation
  • FLEXI R&D Award - The Wearable Device for Dynamic Assessment of Hydration Team (GE Global ResearchUESThe University of ArizonaUniversity of ConnecticutUniversity of Massachusetts AmherstDublin City University and AFRL) for developing a paper-based biofluid patch that collects sweat for human hydration index monitoring
  • Technology Leadership in Education - James Turner from Binghamton University for outstanding leadership and attention to mentoring students during the development of an FHE electrocardiography (ECG) patch.
  • Industry Leadership - David Morton formerly with the Army Research Laboratory for his dedication to building awareness of advanced flexible hybrid electronics in the broader field of electronics.
  • Technology Champion - Robert Reuss, former program manager in the Microsystems Technology Office at DARPA for his extraordinary dedication to growing the flexible electronics industry, early recognition of the impact of large-area electronics and strong contributions to helping build the FLEX conference.


  • FLEXI Product Innovation Award - YUASA System Co, Ltd. for their FX-FSC90 Tension-Free U-shape Folding Test Jig, a tension- and friction-free FHE testing jig that returns consistent and accurate data from bending tests. 
  • FLEXI Product Innovation Award - NuCurrent for developing efficient printed antennas for wireless power transfer.  NuCurrent’s technology enabled the world’s first through-table charge approved by the FCC and the AirFuel standard. 
  • FLEXI R&D Award - Ana Claudia Arias from the University of California, Berkeley for the development of flexible medical sensors and printed flexible devices. Her breakthrough research has led to the creation of flexible receiving coils for magnetic resonance imaging devices and devices for impedance sensing for the detection of early pressure ulcers in vivo.
  • Technology Leadership in Education Award - Brewer Science for establishing a company culture that fosters creativity and innovation.
  • FLEXI for Industry Leadership Award - Dalen Keys from DuPont for his technical acumen and business development experience. At critical junctures, Keys provided leadership that resulted in public/private partnerships among industry, government and the R&D communities.  


  • FLEXI Innovation Award – Sensor Films, Inc., for the Starlight Digital Manufacturing Platform. This tool brings a modular approach to flexible and hybrid electronics manufacturing with large area deposition of functional and decorative materials on cut-sheet, flexible, porous or rigid substrates and is scalable to roll-to-roll production.
  • FLEXI Innovation Award - Blue Spark Technologies, for its TempTraq product, a wearable temperature monitor in the form of a soft, comfortable patch that provides a continuous body temperature reading.
  • FLEXI R&D Award – Scientists at the University of Massachusetts Lowell for research conducted into a ferroelectric nano-ink for printing electrostatically-tunable dielectrics on plastic substrates using direct-ink writing methodologies.
  • Technology Leadership in Education FLEXI Award – to Northeastern University's Center for High Rate NanoManufacturing, which has educated more than 130 students on the topics of directed assembly-based printing, synthesis of organic semiconductor and polymers engineering.  
  • FLEXI Award for Industry Leadership - to Daniel R. Gamota in recognition of his outstanding thought leadership and vision for printed electronics, particularly his strategic roadmap development activities and standards work.


  • FLEXI Innovation Award – Thin Film Electronics, ASA, for the NFC Smart Label. This small label can store and sense data such as time and temperature, and wirelessly communicate the information to internet-connected devices via NFC technology.
  • FLEXI R&D Award – Pacific Northwest National Laboratory and Vitex Systems for the development of Barix®. Barix’s basic principles have been critical to a new generation of curved and flexible OLED displays that are just emerging in the marketplace.
  • Technology Leadership in Education Award – Cal Poly’s Graphic Communication Department for the establishment of a Certificate and Master’s degree program in the area of Printed Electronics and Functional Imaging. Through this program, students acquire the essential knowledge and skills to carry into the printing and design worlds.


  • FLEXI Innovation Award – MC10 for its sports and activity impact indicator designed for athletes of all ages and skill-levels, the CHECKLIGHT ™.
  • FLEXI R&D Award
  • Imprint Energy for development of the first truly rechargeable battery based on an ultrathin Zinc polymer cell structure and printed onto flexible substrates.
  • Plastic Logic for their demonstration of ISORG’s organic printed photodetectors onto an OTFT backplane, creating a flexible, ultra-light, ultra-thin and robust sensor.
  • Technology Leadership in Education Award – Dr. Bruce Kahn for his exemplary contributions to the printed electronics field since 2002, including teaching, training, writing, researching, and advising in the field.


  • FLEXI Innovation Award – American Semiconductor won the award for its Flexible Hybrid Systems with FleXTM Silicon-on-PolymerTM, a proprietary process to transform standard silicon wafers into flexible wafers.
  • FLEXI R&D Award – Two companies were recognized individually for their achievements in R&D. Corning received the award for Corning Willow Glass, a thin and flexible display-grade glass that has benefits for a variety of electronic devices. Plastic Logic received the award for its scalable color filter alignment process, a transformational technology that enables the integration of color displays into flexible concepts.



  • FLEXI Innovation Award – E-Ink won the award for its global innovation of electrophoretic displays in the flexible display industry.
  • FLEXI R&D Award – Polyera, a supplier of functional materials for the printed and flexible electronics industry, has been a leading player in the development of materials, in particular pioneering the development of high-performance, user-friendly n-type semiconductor materials.
  • Technology Leadership in Education Award – TheDoctoral Training Centre (DTC) in Plastic Electronics, Imperial College London (ICL) for the breadth of disciplines including materials physics, optoelectronics, physical chemistry, device engineering/modeling, and design, synthesis, and processing of molecular electronic materials. The Imperial College DTC meets this challenge by having aggressively invested in the broad field of Flexible Electronics that resulted in appointments in Physics, Chemistry, Materials, and the Institute of Biomedical Engineering.


  • FLEXI R&D Award – HP and PowerFilm Solar for the SAIL (self-aligned imprint lithography) process, whereby a 3D masking structure is molded on top of the full stack of un-patterned thin films required for the electronic backplane.
  • FLEXI Innovation Award – Infinite Power Solutions wins for their THINERGY™ MEC® (Micro-Energy Cell) products – revolutionary solid-state, rechargeable, energy storage solutions that serve a variety of vertical markets.
  • Technology Leadership in Education Award – Darmstadt University of Technology received the FLEXI Award for developing the interdisciplinary program “Printed Electronics”, which addresses materials, conventional and digital printing technologies, electronic devices and circuit design at the advanced degree level.


  • FLEXI Innovation Award – Kent Displays for the eNote Liquid Crystal Writing Tablet (later renamed the Boogie Board) an environmentally-friendly tablet used to write with a finger or stylus and erase with a button push.
  • FLEXI R&D Award – DuPont Teijin Films won for the development of its PET and PEN polyester films, now in use by numerous manufacturers of flexible displays and other emerging products.
  • Technology Leadership in Education Award – Multiple awards were presented to Binghamton UniversityCornell UniversityEndicott Interconnect Technologies, and Princeton University.  The organizations were recognized for pioneering activity in the development of academic white papers on flexible and printed electronics. And, in the case of Binghamton University, Cornell University, and Endicott Interconnect Technologies, recognition was given for pioneering course work at the university level.
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