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Programs Catalog

Programs Catalog

MEMS & SENSORS TECHNICAL CONGRESS — MSTC 2020

TECHNOLOGIES DRIVING THE NEXT WAVE OF SMART MEMS & SENSING SOLUTIONS—
The Impact of 5G, AI, and Smart 'Everything’ 

Tuesday, February 25        8:00am–6:00pm
Wednesday, February 26   8:00am–5:45pm 


MSTC CALL FOR ABSTRACTS IS NOW OPEN! Submit by October 31, 2019

SEMI, the MEMS & Sensors Industry Group (MSIG), and the MEMS & Sensors Technical Congress (MSTC) Speaker Selection Committee invite you to submit an abstract for one or more of the following areas:

  • Oral Presentation

  • TechTALKS Demonstration and Presentation

  • Student Poster Display and Competition

NEW VENUE!

MSTC 2020 hosted at the DoubleTree by Hilton in San Jose, California. The venue is conveniently located less than one mile from the San Jose International Airport!  Registration and the MSTC highlights will be available in October 2019. 

The MEMS & Sensors Technical Congress — MSTC 2020 is designed for technical executives, engineering, design and product engineers across the MEMS and sensors supply chain and adjacent industries. This year will see a different format to truly focus on the needs of the key innovators in our industry.  MEMS and sensors technology challenges from silicon fabrication, packaging, test, hardware, and software design will be addressed together with the impact of adjacent technologies of the ecosystem.  The opportunities and challenges brought about by key growth areas such as Artificial Intelligence, Machine Learning, 5G, and Blockchain will be front and center. The existing and emerging MEMS and sensors markets together with the resulting new component, software, and systems needs will be highlighted. MSTC features key networking and problem-solving discussions and opportunities for all attendees. 

WHO SHOULD ATTEND?

  • CTOs
  • Senior Technical Executives
  • Executive Vice Presidents of Technologies
  • Engineering Vice Presidents, Directors, Managers, and Designers
  • System Engineers and Integrators
  • Software Solutions Engineers and Developers
  • Startup Founders
  • Academia
  • Research and Development Engineers
  • Market Analysts
  • Market Researchers
  • Consulting Firms

MSTC 2020 SPEAKER SELECTION COMMITTEE 

Thank you to these prestigious industry leaders for their time and guidance. 

  • Michael A. Helmbrecht, PhD, Product Development & Manufacturing, AM Fitzgerald 
  • Tony Zarola, General Manager, Analog Devices (ADI) 
  • Andre Rouzaud, PhD, Microsystem, Deputy VP, CEA-Léti
  • Nicole Kerness, VP of Sensor Design and Technology, Kionix
  • Evgeni Gousev, PhD, Senior Director, Qualcomm Technologies
  • Uma Krishnamoorthy, Director, Robert Bosch
  • Thomas Kenny, PhD, Richard Weiland Professor and Senior Associate Dean of Engineering, Student Affairs, Stanford University
  • Mahesh Chowdhary, PhD, Director & Fellow, Strategic Platforms and IoT Excellence Center, STMicroelectronics
  • Tia Williams, Texas Instruments

 

Event Contact

Lin Tso
Sr. Program & Event Manager, SEMI
ltso@semi.org

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Tech Courses, FLEX Sessions, MSTC Sessions Spyglass Monday, February 18
1:00pm to 4:00pm

From Lab to Fab: Materials, Printing and Processing of Flexible Hybrid Electronics

Instructors:

  • Michael A. Mastropietro, ACI Materials

  • Mark D. Poliks, Binghamton University

  • Wilfried Bair, NextFlex Manufacturing USA

  • James J. Watkins, University of Massachusetts, Amherst

 

From Lab to Fab: Materials, Printing, and Processing of Flexible Hybrid Electronics

This course will review the three main approaches to FHE as well as the underlying technologies required to deliver products and processes now and in the future. These three approaches include chip-on-flex, micron-scale thin-film devices on flex and sub-micron scale self-assembled/imprinted device based coatings on flex. The discussions will include fundamentals of printing, coating and patterning technologies, as well as challenges associated with pick and place, attachment of thinned silicon, die on flex and emerging technologies that will enable direct printing of highly integrated components and devices.  Based on their experience, participation in NBMC and NextFlex R&D projects and reviews of the technical literature, the instructors from ACI Materials, Inc., Binghamton University, NextFlex and the University of Massachusetts at Amherst will provide a comprehensive overview of applications, design approaches, and trending developments in manufacturing methods of FHE.     

An optional tour of NextFlex will be available on Friday, February 22, 2019, at 2:00pm PST.  Transportation will not be provided.  Sign up to participate in this workshop.  Participation subject to approval of NextFlex.

Course Outline
  1. Introduction
  • Historical Perspective and Needs
  1. Printed Electronics
  • Designing for FHE
  • Selecting the right print method and ink for an additively manufactured circuits
  • Basic performance metrics of printed conductors and functional materials
  • Introduction to various printing methods for functional inks: direct write methods: ink-jet, aerosol-jet, extrusion, micro-dispensing, and more
  • Printing methods requiring a master: screen printing, flexo, gravure, gravure offset
  • Coating methods: slot-die, Meyer rod
  • Challenges of drying and curing functional inks
  1. Design-for-fabrication, variability and controls in 2, 3 and 5 axis aerosol jet printing
  1. Heterogeneous integration, flexible hybrid electronics and packaging overview
    • Electronics packaging and assembly for FHE
    • NextFlex Manufacturing USA and NextFlex pilot line
    • Design and fabrication of a flexible Arduino using bare-die integration
    • Design and fabrication of wearable FHE human performance monitors
  1. Roll-to-Roll Manufacturing
  • Substrates: plastic, metal foils, thin flexible glass
  • Coatings: metal, TCO, dielectrics, thin film semiconductors
  • Vacuum processes: PVD/sputter, plasma etch, laser ablation
  • Photolithographic patterning
  • Design and fabrication of active & passive Integration on thin flexible glass and ceramic:  interposer, TFTs and antennas
  • Design and fabrication of printed sensors on paper
  1. Emerging Methods and Technologies
  • Imprint lithography
  • Spatial ALD
  • Directed self assembly
  • Nanoparticle dispersions
  • Solution-based coatings: additive driven assembly
  • Transfer printing
  • Nano-imprint patterning
  1. Design and fabrication of wearable microfluidic based sensors
  1. Continuous Nanofabrication Processes
  • Applications, requirements, design and fabrication of:
    • Large area infrared sensors
    • Large area energy and light management with meta structures
    • Antimicrobial/super hydrophobic surfaces for biomedical devices
    • Power storage
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Tech Courses, FLEX Sessions, MSTC Sessions Cypress Monday, February 18
1:00pm to 4:00pm

Instructors:

  • Ryan E. Giedd, Director of Sensor Research & Development, Brewer Science

  • Rishi Patel, Senior Research Scientist, Jordan Valley Innovation Center, Missouri State University

  • Suresh K. Sitaraman, Regents’ Professor, Mechanical Engineering, Georgia Institute of Technology

 

Printed Flexible Electronic Devices: Signal Interface and Reliability Assessment

About the instructors: Ryan E. Giedd, Ph.D., of Brewer Science will serve as the primary instructor and has more than 25 years of experience in this field. His co-instructors also bring some very unique experience to this short course. Suresh K. Sitaraman, Ph.D., of the Georgia Institute of Technology, has much expertise in mechanical PE reliability performance standards. Rishi Patel of the Jordan Valley Innovation Center at Missouri State University brings much knowledge of printed carbon nanotube memory devices.

Simple or complex flexible printed electronic devices such as: metallic vias, traces, or semiconducting carbon nanoparticle networks, require significant signal and mechanical reliability assessment for general characterization and reporting commercial performance. Much time has been lost in advancing commercial printed electronics (PE) devices as a result of improper electronic impedance matches, poor electrical contact morphologies, and insufficient mechanical stability. In this course, we will review these issues and provide real-world solutions that are reliable and relatively easy to implement. We will identify the proper tools and give instrumentation examples for characterizing resistive, capacitive, and inductive PE elements from both an electronic and mechanical reliability perspective. We will review data analysis techniques for electronic impedance and mechanical reliability measurements with an emphasis on flexible PE devices rather than traditional approaches to characterizing rigid Si-based electronic devices. We will also discuss the effects of using polymer substrates where slow water diffusion can cause electronic signals that look like instabilities but are in reality responses to ultraslow diffusion processes and briefly discuss how to handle electrical contact to PE devices in aqueous or high-humidity environments. Finally, we will review techniques for mapping physical and mechanically induced damage in the field for PE devices.

Course Outline:

  1. Printed Electronic Device Assessment
    1. Background Morphology and Microstructure
  1. Measurements I – Electrical Contacts and Interfaces to PE Elements
    1. Fast screening and optimization
    2. Example of simple-to-use contact electrodes and electrode morphology
    3. Physical effects and spurious signals
      1. Flex/vibrational/acoustic signals
      2. Fluctuating temperature background
      3. Stability of changing relative humidity environments
    4. Using LF rather than DC
      1. Filtering advantages
      2. Current reversing advantages
      3. Fast look at higher frequencies to check for instabilities
  1. First Demonstration – A Simple, Fast Screening Electronic Measurement System
  1. Measurements II – Stability and Repeatability in PE Devices
    1. Flexible polymer substrates
      1. Long-term and short-term water absorption/desorption
      2. Static electricity and charge induction in PE semiconductors
    2. WVTR (water vapor transmission rate) and encapsulation
      1. Long-term temperature and relative humidity stability experiments
      2. Insulating encapsulants under metal layer barriers
      3. Floating gate issues
    3. Equivalent circuits for the LF and HF response of PE semiconductor films
      1. Morphological models
      2. Electrochemical models
    4. Post-processing of high-conductivity PE films
      1. Grain boundary effects
      2. Short duty cycles at ultrahigh currents
      3. Transmission line and network analyzer measurements
  1. Second Demonstration – Frequency Response Characterization of PE Films
  1. Reliability Assessment for Printed Electronics
    1. Materials of Interest
      1. Flexible Substrate Materials
      2. Printing Methods and Inks
      3. Encapsulants and Coatings
    2. Applicable Reliability Tests for Printed Flexible Electronics
      1. Overview of Standards and Guidelines
      2. Uniaxial Tests – Stretch, Bend, Fold, Twist
      3. Adhesion and Interfacial Delamination Tests
      4. Multiaxial Tests
      5. Environmental Tests
      6. Combination of Tests
    3. Damage Evolution and Analysis
      1. Stress and Strain Distribution
        1. Computational Models
        2. Experimental Techniques
      2. Imaging and Failure Analysis
  1. Third Demonstration – Reliability Tests and Damage Evolution
  1. Field Use Reliability and Mapping of Damage
    1. Overview of Field Use and Mapping in Rigid Electronics
      1. Biomedical Application
      2. Automotive Application
      3. Aerospace Application
      4. Load Sequencing and Damage Accumulation
    2. Field Use and Mapping in Flexible Electronics
      1. Wearable/Textile Application
      2. Aerospace Application
      3. Communication Platform
      4. Load Sequencing and Damage Accumulation
  1. Concluding Remarks
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Tech Courses, FLEX Sessions, MSTC Sessions Big Sur Monday, February 18
1:00pm to 4:00pm

The Intersection of MEMS-based Sensors with Flexible Printed Solutions--Addressing the Opportunities and Challenges

Instructors:

  • Chip Spangler, Aspen Microsystems
  • Mary Ann Maher, SoftMEMS 

This course is intended for individuals and organizations interested in exploring the latest innovations in the system design of sensor-based products and systems incorporating flexible, hybrid and printed technologies. The course will provide an overview of the state of the industry and design and manufacturing ecosystems and focus on key system integration challenges for combining sensors with flexible, hybrid and printed technologies. The course will describe both design and manufacturing issues illustrated by examples from the field and will cover the problems encountered at various stages of product development from concept to production. Practical advice and solutions are described for the specific problems brought by combining sensors with flexible, hybrid, printed technologies to create products and resources available to help in designing these systems will be presented. 

Course Outline

1. Market opportunities for Products incoporating MEMS/Sensors with FHPE

2. Technology

  • Sensor/component technology overview
  • Taxonomy of Sensor Integration Methods
  • Substrates/Materials
  • Bonding/Interconnect/Planarization methods
  • Manufacturing challenges/solutions
  • Packaging challenges/solutions
  • Assembly/handling challenges/solutions
  • Test/reliability challenges/solutions
  • Summary and Call to action

3. Systems Design Challenges

  • Computing requirements and implementation
  • Security requirements and implementation
  • Combo/Multiple Sensors
  • Powering methods
  • Communications methods
  • Summary and Call to action

4. Productization challenges

  • Cost/Performance/Form Factor
  • Ecosystems and sourcing
  • IP
  • Technology readiness
  • Standards
  • Current issues and limitations
  • Summary and Call to action

5. Computer Aided design

  • Physical Design issues
  • Simulation and modeling of sensors and FHPE
  • Summary and Call to action

6. Detailed examples- examples will be given illustrating the key challenges/solutions of system integration from  medical, wearables, IoT, transportation and industrial applications

7. Future directions

8. Information sources

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Receptions, Networking, FLEX Sessions, MSTC Sessions Regency Terrace Monday, February 18
5:30pm to 6:30pm
Networking, FLEX Sessions, MSTC Sessions Regency Terrace Tuesday, February 19
7:00am to 8:30am
Keynotes & Executive Panels, FLEX Sessions, MSTC Sessions Monterey Ballroom Tuesday, February 19
8:00am to 10:40am

FLEX/MSTC Session 1:  KEYNOTES 

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Networking, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 19
9:30am to 10:30am

Morning Break

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Keynotes & Executive Panels, FLEX Sessions, MSTC Sessions Monterey Ballroom Tuesday, February 19
10:30am to 12:30pm

FLEX/MSTC Session 2: KEYNOTES

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Networking, FLEX Sessions, MSTC Sessions Garden Terrace Courtyard Tuesday, February 19
12:30pm to 2:00pm
Applications, FLEX Sessions Big Sur Tuesday, February 19
2:00pm to 4:05pm

FLEX Session 3: APPLICATIONS I

 

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Display Technologies, FLEX Sessions Tuesday, February 19
2:00pm to 3:45pm

FLEX Session 4: DISPLAY TECHNOLOGIES 

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MSTC Sessions, End to End Solutions Tuesday, February 19
2:00pm to 4:00pm

MSTC Session 3: END TO END SOLUTIONS

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 19
2:00pm to 2:15pm

Jaye Tyler, Nissha Si-Cal Technologies

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 19
2:15pm to 2:30pm
TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 19
2:30pm to 2:45pm

Steve Chiu, ITRI

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 19
2:45pm to 3:00pm
TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 19
3:00pm to 3:15pm

Kurt Christenson, Optomec

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 19
3:30pm to 3:45pm

Ryan Giedd, Brewer Science, Inc.

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Receptions, Networking, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 19
4:00pm to 6:00pm

Networking Reception 

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Networking, FLEX Sessions, MSTC Sessions Regency Terrace Wednesday, February 20
7:00am to 8:30am
Applications, FLEX Sessions Big Sur Wednesday, February 20
8:00am to 9:25am

FLEX Session 5: APPLICATIONS II

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Manufacturing, FLEX Sessions Wednesday, February 20
8:00am to 9:25am

FLEX Session 6: FLEX MANUFACTURING I

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Sensors, FLEX Sessions Windjammer Wednesday, February 20
8:00am to 9:25am

FLEX Session 7: SENSORS I

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MSTC Sessions Spyglass Wednesday, February 20
8:30am to 12:00pm

MSTC Session 4:  SMART TRANSPORTATION

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Networking, MSTC Sessions, FLEX Sessions Exhibit Hall Wednesday, February 20
9:25am to 10:25am
Sensors, FLEX Sessions Windjammer Wednesday, February 20
10:25am to 11:50am

FLEX Session 10: SENSORS II

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Flexible Hybrid Electronics Technology, FLEX Sessions Big Sur Wednesday, February 20
10:25am to 11:50am

FLEX Session 8: FLEXIBLE HYBRID ELECTRONICS TECHNOLOGY

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Manufacturing, FLEX Sessions Cypress Wednesday, February 20
10:25am to 11:50am

FLEX Session 9: FLEX MANUFACTURING II

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
10:30am to 10:45am

Low Temperature Stretchable Bonding Technology Applicable to Flexible Substrates  

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
10:45am to 11:00am

Wei Wu, DuPont

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
11:00am to 11:15am

Sivapurapu Sridhar, Georgia Institute of Technology

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
11:15am to 11:30am

Arsalan Alam, University of California Los Angeles Center for Heterogeneous integration and Performance Scaling

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
11:30am to 11:45am

Jay Esfandyari, STMicroelectronics

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Networking, FLEX Sessions, MSTC Sessions Garden Terrace Courtyard Wednesday, February 20
11:50am to 1:30pm
Interconnect, FLEX Sessions Big Sur Wednesday, February 20
1:30pm to 3:15pm

FLEX Session 11: FLEX INTERCONNECT

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Printing, FLEX Sessions Cypress Wednesday, February 20
1:30pm to 3:15pm

FLEX Session 12: PRINTING

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Devices, FLEX Sessions Windjammer Wednesday, February 20
1:30pm to 3:15pm

FLEX Session 13: DEVICES I

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MSTC Sessions, Sensors Wednesday, February 20
1:30pm to 3:05pm

MSTC Session 5: ENABLING SENSORS TECHNOLOGY 

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
1:45pm to 2:00pm
TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
2:00pm to 2:15pm

Rob Podoloff, Tekscan, Inc.

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
2:15pm to 2:30pm

Linh Le, Bonbouton

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
2:30pm to 2:45pm

Hans-Juergen Kahlert, Innovavent GmbH

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TechTALKS, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
2:45pm to 3:00pm

Paul Carey, dpiX

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Networking, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 20
3:15pm to 4:15pm
MSTC Sessions, Emerging Technologies Wednesday, February 20
4:00pm to 5:45pm

MSTC Session 6: EMERGING TECHNOLOGIES

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Reliability, FLEX Sessions Big Sur Wednesday, February 20
4:15pm to 6:00pm

FLEX Session 14: RELIABILITY

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Devices, FLEX Sessions Windjammer Wednesday, February 20
4:15pm to 6:00pm

FLEX Session 15: DEVICES II

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Networking, Receptions, FLEX Sessions, MSTC Sessions, FLEXI AWARD Regency Foyer Wednesday, February 20
6:00pm to 6:45pm

WEDNESDAY, FEBRUARY 20

End the day on a high note!
Come show your support and congratulate this year's Flexi Award and Student Poster winners.

6:00–6:45pm
Regency Foyer

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Networking, FLEX Sessions, MSTC Sessions Regency Terrace Thursday, February 21
7:00am to 8:30am
Applications, Smart MedTech, FLEX Sessions Spyglass Thursday, February 21
8:00am to 9:45am

FLEX Session 16: SMART MEDTECH

Organized by NBMC, Sponsored by UES, Inc. 

 

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Inks, FLEX Sessions Big Sur Thursday, February 21
8:00am to 9:45am

FLEX Session 17: INKS

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Design, FLEX Sessions Cypress Thursday, February 21
8:00am to 9:45am

FLEX Session 18: DESIGN

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Networking, FLEX Sessions, MSTC Sessions Mark Thomas Foyer Thursday, February 21
9:45am to 10:15am
FLEX Sessions, Smart MedTech Spyglass Thursday, February 21
10:15am to 12:00pm

FLEX Session 19: NBMC OPPORTUNITIES FOR SMART MEDTECH

Organized by NBMC, Sponsored by UES, Inc. 

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