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Programs Catalog

Programs Catalog

INNOVATION HUB & LOUNGE —
New Innovative Ideas Start Here! 

Look What's Happening on the First Floor, in the Bayshore Foyer.
 

Innovation and Start-up Company Kiosks

Connect with leading Research Universities & Institutions and Start-Up companies to see breakthroughs in Flexible Hybrid, MEMS, Sensors, Materials, Applications, and other exciting enabling technologies.

Interested in exhibiting? Contact Eric Rude, erude@semi.org or 1.408.943.7047. 

Product Showcase

SEMI-FlexTech R&D programs are unique examples of public/private partnerships. The U.S. Department of Defense granted SEMI-FlexTech multiple contracts to fund cooperative technology development. The three programs under SEMI-FlexTech management include:

  • FlexTech (Flexible Electronics)
  • Nano-Bio Materials Consortium (MedTech)
  • NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, which operates as a semi-autonomous consortium. 

There are new opportunities in “Positioning, Navigation and Timing” to learn more attend FLEX Session 17: Manufacturing USA, or stop by the product showcase to view completed projects.

  • NOW ACCEPTING—Proposals for Funding for Positioning, Navigation & Timing Projects
  • Read the full solicitation for more details.

TechTALKS

Like the show and tell of yesteryear, indulge your curious nature with technical experts sharing their expertise through short 15-minute presentations. Experience lively audience interaction during the Q&A + find answers to your technology questions.

Student Poster Session

View thought-provoking posters on innovative technology projects by students from leading research universities

The Student Poster ideas represent the same conference topics for FLEX and MSTC. Students are competing for trophies judged by a distinguished panel of industry experts, so they are ready and prepared to present their research to you.

Join us to see if your favorite poster wins—

Student Poster Award Ceremony
Wednesday, February 26
6:00–6:45pm, Second Floor, Gateway Foyer

Job Board

Post your organization’s employment openings in printed, flexible hybrid, MEMS, and sensors at FLEX MSTC!  Open to all for posting or reviewing these industry opportunities.

Contact Michelle Fabiano at mfabiano@semi.org for more information.

Topic Lounge

Not your typical area—Refresh. Rest. Renew your energy in the Topic Lounge.
Escape the conference activities to delve deeper into a conference topic, enjoy conversation with a long-time colleague, or enrich new connections.

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MEMS & SENSORS TECHNICAL CONGRESS — MSTC 2020

TECHNOLOGIES DRIVING THE NEXT WAVE OF SMART MEMS & SENSING SOLUTIONS

Tuesday, February 25        8:00am–6:00pm
Wednesday, February 26   8:00am–6:00pm 

MSTC AGENDA


NEW VENUE!

MSTC 2020 hosted at the DoubleTree by Hilton in San Jose, California. The venue is conveniently located less than one mile from the San Jose International Airport! 

The MEMS & Sensors Technical Congress — MSTC 2020 is designed for technical executives, engineering, design and product engineers across the MEMS and sensors supply chain and adjacent industries. This year will see a different format to truly focus on the needs of the key innovators in our industry.  MEMS and sensors technology challenges from silicon fabrication, packaging, test, hardware, and software design will be addressed together with the impact of adjacent technologies of the ecosystem.  The opportunities and challenges brought about by key growth areas such as Artificial Intelligence, Machine Learning, 5G, and Blockchain will be front and center. The existing and emerging MEMS and sensors markets together with the resulting new component, software, and systems needs will be highlighted. MSTC features key networking and problem-solving discussions and opportunities for all attendees. 

WHO SHOULD ATTEND?

  • CTOs
  • Senior Technical Executives
  • Executive Vice Presidents of Technologies
  • Engineering Vice Presidents, Directors, Managers, and Designers
  • System Engineers and Integrators
  • Software Solutions Engineers and Developers
  • Startup Founders
  • Academia
  • Research and Development Engineers
  • Market Analysts
  • Market Researchers
  • Consulting Firms

MSTC 2020 SPEAKER SELECTION COMMITTEE 

Thank you to these prestigious industry leaders for their time and guidance. 

  • Michael A. Helmbrecht, PhD, Product Development & Manufacturing, AM Fitzgerald 
  • Tony Zarola, General Manager, Analog Devices (ADI) 
  • Andre Rouzaud, PhD, Microsystem, Deputy VP, CEA-Léti
  • Nicole Kerness, VP of Sensor Design and Technology, Kionix
  • Evgeni Gousev, PhD, Senior Director, Qualcomm Technologies
  • Uma Krishnamoorthy, Director, Robert Bosch
  • Thomas Kenny, PhD, Richard Weiland Professor and Senior Associate Dean of Engineering, Student Affairs, Stanford University
  • Mahesh Chowdhary, PhD, Director & Fellow, Strategic Platforms and IoT Excellence Center, STMicroelectronics
  • Tia Williams, Texas Instruments

 

THERE'S STILL TIME FOR YOU TO PARTICIPATE—SHARE YOUR EXPERTISE!

MSTC CALL FOR ABSTRACTS ACCEPTING APPLICATIONS 

SEMI, the MEMS & Sensors Industry Group (MSIG), and the MEMS & Sensors Technical Congress (MSTC) Speaker Selection Committee invite you to submit an abstract for one or more of the following areas:

  • TechTALKS Demonstration and Presentation

  • Student Poster Display and Competition

Event Contact

Lin Tso
Sr. Program & Event Manager, SEMI
ltso@semi.org

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STUDENT POSTERS AT FLEX / MSTC 2020!

   
 

Specifications and Instructions for Poster DisplaysSTUDENT POSTER INSTRUCTIONS 

 

SUBMIT AN ABSTRACT FOR:

  • FLEX Conference 2020
  • MEMS & Sensors Technical Congress—MSTC 2020 

For the:

  • Student Posters Display/Competition


FLEX Abstract Topics and More

SEE THE FUTURE WITH 20/20 VISION

Flexible hybrid electronics represents high performance integrated devices that are curved and variable in form factor. Electronics that augment our daily activities and interact with our surroundings like no personal computing device ever has are emerging in new and varied application spaces. And as methods to design and build these devices are developed, business and supply chain paradigms are challenged. Building outside the box requires thinking outside the box. Speakers will highlight the latest technical breakthroughs, unique electronics applications, and business strategies. This FHE go-to event is the center of technical and informative demonstration of flexible hybrid and printed electronics products, equipment, processes and materials and the applications they enable.  We are inviting speakers from across the electronics supply chain to present on FHE innovation and the impact it is having on the future of electronic products.

MEMS & Sensors Technical Congress Abstract Information

TECHNOLOGIES DRIVING THE NEXT WAVE OF SMART MEMS & SENSING SOLUTIONS

MEMS and sensors technology challenges such as silicon fabrication, packaging, test, hardware, and software design will be addressed together with the impact of adjacent technologies of the ecosystem. The opportunities and challenges brought about by key growth areas such as Artificial Intelligence, Machine Learning, 5G, and Blockchain will be front and center. The existing and emerging MEMS and sensors markets together with the resulting new component, software, and systems needs will be highlighted. 

Speakers will present unique application requirements, system-level architecture, integration challenges and how to manage and overcome them successfully. We are inviting technical topics from across the entire MEMS/Sensors supply chain as it pertains to the next wave of MEMS & Sensing Solutions. 


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FLEX Sessions, MSTC Sessions Bayshore Foyer Monday, February 24
2:00pm to 6:30pm
FLEX Sessions, MSTC Sessions Monday, February 24
4:00pm to 5:30pm

Diversity: Women-In-Tech 

  

Back by popular demand, the Women-in Tech returns to FLEX 2020! All conference attendees are welcome.

Join us for a continued discussion around diversity and workforce development in the electronics manufacturing industry. Implicit, and sometimes, explicit bias over generations in our personal and professional lives have driven many promising minds from pursuing careers in STEM. At the same time, diversity in the general workforce and leadership positions has been proven to make companies more successful. It’s possible to revise this contradictory juxtaposition through policies and programs which counter the bias and show the possibilities to a diverse and upcoming class of engineers and scientists who can drive change.

A one-hour meeting agenda and discussion expands upon these concepts, followed by a half-hour mixer, where we can support our colleagues and explore the paths to a bias-free working environment and better overall results. A diverse team leads to varied and more effective problem-solving.

Since 2015, the FLEX conference has been the platform for enlightening and useful discussion, raising several issues incorporated into the current SEMI Workforce Development activities.  If you haven’t already done so, get involved to continue the dialog and share your experience with programs, policies, and cultures that change the industry norms.   

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Receptions, Networking, FLEX Sessions, MSTC Sessions Gateway Foyer Monday, February 24
5:30pm to 6:30pm

FLEX/MSTC WELCOME RECEPTION

Please join us to kick-off the FLEX and MSTC week. Enjoy Conversation, Camaraderie, and Refreshments!

 

             

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Networking, FLEX Sessions, MSTC Sessions Gateway Foyer Tuesday, February 25
7:00am to 8:00am

Networking Breakfast

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Keynotes & Executive Panels, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 25
8:00am to 9:00am

SESSION 1: KEYNOTES (FLEX/MSTC)

Session Chair: Michael McCreary, E Ink Corporation​

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Networking, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 25
9:30am to 10:30am

Morning Break

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Keynotes & Executive Panels, FLEX Sessions, MSTC Sessions Gateway Ballroom Tuesday, February 25
10:30am to 12:30pm

SESSION 2: KEYNOTES (FLEX/MSTC)

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Networking, FLEX Sessions, MSTC Sessions Tuesday, February 25
12:30pm to 2:00pm

NETWORKING LUNCH

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FLEX Sessions Oak Tuesday, February 25
1:30pm to 3:15pm

SESSION 5: Displays & Optoelectronics I

Session Chair: Michael McCreary, Eink

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MSTC Sessions Tuesday, February 25
1:50pm to 4:00pm

SESSION 2: Industry Trends and Applications of MEMS & Sensors

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FLEX Sessions Pine Tuesday, February 25
2:00pm to 4:05pm

SESSION 3: FHE Applications

Session Chair: Kei Hyodo, Yuasa System Co. Ltd.

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FLEX Sessions Fir Tuesday, February 25
2:00pm to 3:45pm

SESSION 4: Materials

Session Chair: Robert Praino, Chasm Advanced Materials

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Receptions, Networking, FLEX Sessions, MSTC Sessions Exhibit Hall Tuesday, February 25
4:00pm to 6:00pm

Networking Reception 

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Networking, FLEX Sessions, MSTC Sessions Gateway Foyer Wednesday, February 26
7:00am to 8:30am

CONTINENTAL BREAKFAST

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FLEX Sessions Wednesday, February 26
8:00am to 9:25am

SESSION 6: Power

Session Chair: Mark Poliks, Binghamton University

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FLEX Sessions Fir Wednesday, February 26
8:00am to 9:25am

SESSION 7: Substrates & Barriers

Session Chair: Scott Gordon, DuPont Teijin Films

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FLEX Sessions Oak Wednesday, February 26
8:00am to 9:25am

Session 8: Displays & Optoelectronics II

Session Chair: Eric Forsythe, Army Research Laboratory
 

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MSTC Sessions Wednesday, February 26
8:30am to 10:25am

MSTC SESSION 4: Emerging  Manufacturing Innovations for Sensors and MEMS 

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Networking, MSTC Sessions, FLEX Sessions Exhibit Hall Wednesday, February 26
9:25am to 10:25am

Networking Break

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FLEX Sessions Fir Wednesday, February 26
10:25am to 11:50am

SESSION 10: Printing Technologies

Session Chair: Robert Praino, Chasm Advanced Materials
 

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FLEX Sessions Oak Wednesday, February 26
10:25am to 11:50am

SESSION 11: Reliability—Characterization

Session Chair: Erica Montback, Kent Displays 

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FLEX Sessions Pine Wednesday, February 26
10:25am to 11:50am

SESSION 9: Sensors

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MSTC Sessions Wednesday, February 26
10:25am to 12:00pm

MSTC SESSION 4: Emerging  Manufacturing Innovations for Sensors and MEMS 

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Jay Esfandyari
STMicroelectronics
TechTALKS Wednesday, February 26
10:45am to 11:00am
Bao Tran
T-Technology
TechTALKS Wednesday, February 26
11:00am to 11:15am
Networking, FLEX Sessions, MSTC Sessions Wednesday, February 26
11:50am to 1:30pm
FLEX Sessions Pine Wednesday, February 26
1:30pm to 3:15pm

SESSION 12: FHE Medical/Wearable Applications

Session Chair: Stephen Farias, NanoDirect LLC

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FLEX Sessions Fir Wednesday, February 26
1:30pm to 3:15pm

SESSION 13: State of the Art FHE Manufacturing​​

Session Chair: Scott Miller, NextFlex

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FLEX Sessions Oak Wednesday, February 26
1:30pm to 3:15pm

SESSION 14: Reliability—Metrology

Session Chair: Mark Poliks, Binghamton University

 

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MSTC Sessions Wednesday, February 26
1:30pm to 3:05pm

MSTC SESSION 5: IOT—From Components to Solutions

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Carolyn Ellinger
Eastman Kodak Company
TechTALKS Wednesday, February 26
1:45pm to 2:00pm
Amit Lal
Geegah LLC, Cornell University
TechTALKS Wednesday, February 26
2:00pm to 2:15pm
Shomeek Mukhopadhyay
Obsidian Advanced Manufacturing
TechTALKS Wednesday, February 26
2:15pm to 2:30pm
Vahid Akhavan
NovaCentrix
TechTALKS Wednesday, February 26
2:30pm to 2:45pm
Albert Lu
Interlink Electronics
TechTALKS Wednesday, February 26
2:45pm to 3:00pm
Networking, FLEX Sessions, MSTC Sessions Exhibit Hall Wednesday, February 26
3:15pm to 4:15pm

Networking Break

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MSTC Sessions Wednesday, February 26
4:00pm to 5:55pm

MSTC SESSION 6: VC (Investors) & Startups 

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FLEX Sessions Pine Wednesday, February 26
4:15pm to 6:00pm

SESSION 15: Heterogeneous Integration of Flexible Electronics

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FLEX Sessions Fir Wednesday, February 26
4:15pm to 6:00pm

SESSION 16: 3D Printed Electronics: From Devices to Systems

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FLEX Sessions Oak Wednesday, February 26
4:15pm to 6:00pm

SESSION 17: Manufacturing USA

Session Chair: Eric Forsythe, Army Research Laboratory

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FLEX Sessions, MSTC Sessions Wednesday, February 26 6:00pm

SUBMIT A NOMINATION FOR THE 2020 FLEXI AWARD!
 

The FLEXI Awards recognizes the achievements of organizations and individuals in the flexible electronics sector in the categories of:

  • Innovation & Commercialization

  • R&D

  • Education Leadership

  • Industry Leadership


The 2020 FLEXIs is open to any organization involved with the flexible and printed electronics sector.

___________________________________

AWARDS & CRITERIA 

  • PRODUCT INNOVATION AWARD CRITERIA: Entries for this award should be on a flexible electronics product announced in the last twelve months and are awarded to the organization responsible for its creation. Nominations will be judged based on the product design & ingenuity, potential (or proven) market adoption, and revenue generation. Products must be available to customers at the time of nomination.
     
  • R&D ACHIEVEMENTS AWARD CRITERIA: Entries for this award are evaluated for their world-class research approach, originality and commercial potential for expanding the scope for flexible or printed electronics or their manufacturing processes. Consideration is given to the ability of entrants to identify and solve a real problem.
     
  • TECHNOLOGY LEADERSHIP IN EDUCATION AWARD CRITERIA: This award recognizes and honors outstanding contributions to the flexible electronics industry through education, both via a certified education institution or internal corporate workforce development activity. Judging is based on the quality of education, practical applicability, number of students completing the course, and degree of focus on flexible, printed electronics.
     
  • INDUSTRY LEADERSHIP AWARD CRITERIA: This award will recognize and honor an individual who has shown particular dedication to building awareness of the capabilities and possibilities that flexible and hybrid electronics bring to the broader field of electronics. The individual honored will have demonstrated outstanding leadership for the industry in public forums, association activity, and within their own organization.
     
  • TECHNOLOGY CHAMPION AWARD CRITERIA: This award will recognize and honor an individual for their volunteering efforts and contributed achievements in the flexible and hybrid electronics industry. 

The FLEXI Awards are awarded annually by FlexTech based on the stated criteria. A panel of industry experts come together once a year to evaluate the submissions and determine the award. The FLEXI Award does not constitute an implicit endorsement of the recipient or its products.

2020 FLEXI AWARDS CEREMONY & RECEPTION

The FLEXI Award recipient(s) will be honored at the FLEX/MSTC 2020 event.

Wednesday, February 26
6:00 pm

PAST FLEXI AWARD WINNERS


 

 

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Networking, FLEX Sessions, MSTC Sessions SEMI HQ - The Valley Thursday, February 27
8:30am to 9:00am

Continental Breakfast

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Thursday, February 27 9:00am

See the list of Tech Courses here. 

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FLEX Sessions, MSTC Sessions Thursday, February 27
9:00am to 12:00pm

Tech Courses FLEX/MSTC

Location: SEMI HQ | 673 S. Milpitas Blvd |  Milpitas, CA 95035

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Networking, FLEX Sessions, MSTC Sessions SEMI HQ - The Valley Thursday, February 27
12:00pm to 1:30pm

Networking Lunch

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NEXTFLEX | 2244 Blach Place, Suite 150 | San Jose, CA 95131 Friday, February 28
9:00am to 11:00am

Tour the NextFlex Technology Hub where design, prototyping and pilot-scale manufacturing of flexible hybrid electronics is transforming the way we think about electronics. Led by NextFlex technical staff, view five types of printing, thin die integration and assembly, and the testing lab in action. Now ITAR and FDA compliant, the NextFlex Technology Hub are delivering on the promise of next-generation electronics that bend, flex and stretch. 

  • FREE Tour 
  • ​Limited to 100 Guests
  • Transportation Not Provided
  • NextFlex has the right to approve attendance 

Four 30-minute tours and can take up to 25 people on each tour. Attendees do not need to sign up for a time. They will just be put on the tour depending on what time they arrive. The last tour will be given at 10:30 am

 

 

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Networking, FLEX Sessions, MSTC Sessions NEXTFLEX | 2244 Blach Place, Suite 150 | San Jose, CA 95131 Friday, February 28
9:00am to 11:00am

TOUR: NextFlex Technology Hub

Tour the NextFlex Technology Hub where design, prototyping and pilot-scale manufacturing of flexible hybrid electronics is transforming the way we think about electronics. Led by NextFlex technical staff, view five types of printing, thin die integration and assembly, and the testing lab in action. Now ITAR and FDA compliant, the NextFlex Technology Hub are delivering on the promise of next-generation electronics that bend, flex and stretch. 

  • FREE Tour 
  • ​Limited to 100 Guests
  • Transportation Not Provided
  • NextFlex has the right to approve attendance 

Four 30-minute tours and can take up to 25 people on each tour. Attendees do not need to sign up for a time. They will just be put on the tour depending on what time they arrive. The last tour will be given at 10:30 am

 

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