SMT/Die Attach

Fir Wednesday, February 26
2:30pm to 2:45pm

FHE is distinguished from Printed Electronics in part by the incorporation of conventional electronic components. Surface mount and bare die attach technologies have been adopted from the printed circuit board and semiconductor packaging industries for use in FHE. This talk will address specific challenges that have been addressed and overcome, as well as best practices for SMT and thin bare die attach on flex. Remaining challenges and needs would be discussed.

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