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Home
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Programs Catalog
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Flex Session 15 Heterogeneous Integration Flexible Electronics
FLEX SESSION 15: Heterogeneous Integration of Flexible Electronics
Pine
Wednesday, February 26
4:15pm
to
6:00pm
SESSION 15: Heterogeneous Integration of Flexible Electronics
Session Chair: Pavel Dutta, Lumileds
Do you want to attend this session?
Register for Flex and MSTC
Integration of Ultra-thin Solid-State Batteries with High-performance Silicon Microelectronics and Sensors
FLEX Sessions, MSTC Sessions
Wednesday, February 26
4:15pm
Brian Berland
Chief Technology Officer
ITN Energy Systems
Thin Film Electronics Paves Path to Connect Trillion Objects in Creating the Internet-of-Everything
FLEX Sessions, MSTC Sessions
Wednesday, February 26
4:40pm
Prashant Agrawal
Program Manager
imec
Flexible Manufacturing Bridging Conventional and Printed Electronics
FLEX Sessions, MSTC Sessions
Wednesday, February 26
5:00pm
Doug Hackler
President and CEO
American Semiconductor
Development of Inkjet Printing Biosensor on Flexible and Porous Substrates
FLEX Sessions, MSTC Sessions
Wednesday, February 26
5:20pm
Miguel Zea
PhD Candidate
Institute of Microelectronics of Barcelona
Integration Techniques for Roll-to-Roll Compatible Fabrication of Flexible Hybrid Electronics
FLEX Sessions, MSTC Sessions
Wednesday, February 26
5:40pm
Nagarajan Palavesam
Research Associate
Fraunhofer EMFT & Technische Universität Dresden
