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Next Generation 3D Printed Multi-Chip-Modules

Fir Wednesday, February 26
4:15pm to 4:40pm

Next Generation 3D Printed Multi-Chip-Modules

Parsons is actively working with the DoD to conceptualize a new generation of 3D-printed MCMs building off of the success of HERCULES, presented at FLEX 2018. We will present the design concept and progress on COOKIECRISP, a next-generation 3D-printed multi-chip module (MCM). The MCM builds on the success of HERCULES and will be made using aerosol jet printing. COOKIECRISP features two multi-layer printed redistribution layer stacks interconnecting surface mount passive components and three silicon die in a stacked configuration with a print resolution of 25 microns. Once fielded, COOKIECRISP is poised to be a core architectural building block for the DoD. We will also discuss the extensive ink qualification process that Parsons underwent to determine the optimal material set for chip-scale 3D printed electronics solutions.

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