Next Generation Assembly and Interconnect Materials for Smart Structures and Functional Surfaces
Emerging Consumer Electronics and Automotive Electronic interfaces are moving towards tactile, smart, capacitive structures from their current physical and mechanical forms (switches, connectors, housings, etc.). Similarly, standard packaging is also evolving towards Smart and Intelligent Packaging. Sensors and other connectivity devices, also continue to proliferate leading to interconnected Internet of Things (IoT). To enable and deploy these next-generation smart structures and functional surfaces, a combination of smart materials and compatible processes are needed. In this paper, we present a holistic view of materials and high volume manufacturing (HVM) perspectives. We discuss/review key building blocks of 3D Structural Electronics that present an integrated approach, which covers: - Novel film substrates (for example, PC Substrates for Film Insert Molding), - Highly conductive and formable Silver Inks, - High-performance formable Dielectrics (UV Curable and Thermally curable), and - Formable Encapsulants. We present performance and compatibility details of these building blocks and show that mutual inter compatibility needs to be considered along with suitability for use for various types of substrates. Details of several demonstrators showcasing these leading-edge technologies will be presented.