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Materials for Flexible and Stretchable TFT Technologies

Oak Tuesday, February 25
2:35pm to 2:55pm

This presentation will report the realization of several materials needed for the fabrication of flexible thin-film transistors, including the semiconductor, dielectric, and passive components. Particular emphasis will be given to the processing, engineering, and qualification aspects enabling TFT production for display backplane technologies in conventional amorphous-Si FAB facilities. Finally, we will report our vision for enabling materials sustaining far larger bendability/impact resistance mechanical stresses than those required for current-generating flexible EPDs. Thus, one of our semiconductors can be stretch up to >100% without the crack formation and exhibiting good charge transport characteristics.

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