Automated High-volume Flip-Chip Assembly for FHE
FHE commercialization has been limited due in large part to the lack of production assembly methods for thin-devices on printed substrates. This presentation addresses this issue and provides a description of automated assembly capacity for FHE die attach and interconnect for ultra-thin complex ICs. FHE flip-chip assembly methods are presented for anisotropic and low-temperature solder solutions on PET and similar substrates. Current state-of-the-art capability for 100 or less I/O devices with 100um pitch pads will be shown and a call-to-action for further industry development to establish an assembly roadmap to scale assembly capability to high I/O count devices.