Direct Die-placement Technology: A New Approach to Thin and Ultra-thin Die Placement for FHE Applications
A key manufacturing challenge in the assembly of flexible hybrid electronic (FHE) devices is precision, high-throughput placement of thin and ultra-thin silicon-based ICs onto flexible substrates. Due to the thinness and fragility of thin silicon dies and components, along with the mechanical compliance of flexible and soft device substrates, conventional pick-and-place (PnP) manufacturing equipment falls short in terms of yield and planarity. Advances in manufacturing and assembly tools are therefore needed to realize the full potential of hybrid devices that are both high-performance and fully mechanically flexible. In this talk, we will describe a new manufacturing technology – direct die-placement (DDP) technology - that enables the placement of thin and ultra-thin dies and components directly onto flexible or rigid substrates. We will detail the mechanics of the DDP process as it relates to achieving die placement for thin silicon dies and substrates that are specific to particular device requirements, and we will show results for thin silicon dies and components – ranging in thickness from 10s of micrometers down to 300 nm – that have been transferred directly onto flexible polyester sheets. In addition, we will outline the various assembly routes that are enabled by DDP for mass production of FHE devices.