Ultra-thin and Flexible Bluetooth Low Energy ICs
Wireless system capability is a key requirement for FHE commercialization. FHE systems to date have been limited to simple RFIC or NFC capability. Printed antenna substrate and flexible battery capability has been proven that can support Bluetooth applications, but Bluetooth systems have not emerged due to a lack of Bluetooth IC capability for hybrid systems.
This presentation addresses this issue and provides demonstration data for flexible Bluetooth Low Energy (BLE) ICs from two major semiconductor companies. Current state-of-the-art capability for FHE Bluetooth Low Energy (BLE) systems enabled by Semiconductor-on-Polymer (SoP) chip scale packaging (CSP) will be shown. A call-to-action for accelerated industry development to establish improved battery, sensor and display capability will be voiced.