Arsalan Alam received the B.Tech. in Electronics and Communication from AMU, India, in 2011, and the M.Tech. in Microelectronics from IIT Roorkee, India, in 2015. He was a visiting student researcher at KAUST, Saudi Arabia, in 2016. He is currently pursuing a Ph.D. degree with the Center for Heterogeneous Integration and Performance Scaling (CHIPS) group at the University of California, Los Angeles. His current research interests include the development of FlexTrateTM which is a bio-compatible, physically-flexible platform that allows for heterogeneous integration using Fan-Out Wafer Level Packaging (FOWLP) technique for the development of next generation high-performance implantable and wearable applications.