Doug Hackler

President and CEO
American Semiconductor

Douglas Hackler, Co-founded American Semiconductor in 2001 and is currently bringing up a new 300mm Semiconductor-on-Polymer WLCSP facility in Boise. Doug’s team demonstrated the industry’s first commercial physically flexible bulk CMOS SOC in 2017 and has multiple patents and patents pending for conventional and flexible solid-state technology. At American, Semiconductor Doug serves as President and CEO performing overall corporate and operational responsibilities. 

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