Edge of Reality: Augmenting Flexible Hybrid Electronics with AI, Digital Twins, Robotics, and XR
FLEX 2026 | TECHNOLOGY SUMMIT | FEBRUARY 24–26
THE WIGWAM ARIZONA RESORT | PHOENIX, AZ
A 25th Anniversary Celebration
Escape the winter and celebrate 25 years of innovation with us at The Wigwam Arizona Resort in Phoenix, AZ.
FLEX—Technology Summit is a vibrant networking event designed to foster community building. Connect with like-minded professionals, share ideas, and forge lasting relationships that will drive the industry forward.
At FLEX 2026, you'll experience high-quality technical sessions led by industry-leading speakers who are at the forefront of their fields. Sessions include topics on wearable and harsh environment technologies, heterogeneous integration and advanced packaging, flexible hybrid electronics, printed electronics, additive manufacturing, integrated photonics, flexible displays, digital twins, artificial intelligence, and manufacturing. Additionally, you'll gain valuable business insights and market trends that provide a comprehensive view of the state of the industry.
Explore the solution zone to see cutting-edge technologies and connect with innovations shaping the future. Don’t miss this chance to stay ahead in a rapidly evolving tech landscape.
Topics That Are Shaping the Future
FLEX Topics
-Printed Electronics
-Energy Storage & Efficiency
-Additive Manufacturing of Electronics
-Advanced Packaging & Heterogeneous Integration
-Digital Twins
-Flexible & Flexible Hybrid Electronics
-Flexible Display Technology & Applications
-Defense & Harsh Environment Applications
-Wearable & Medical Electronics
-Technology Disruptors & Opportunities
WHO ATTENDS?
FLEX attracts global industry professionals from industry, academia, R&D labs, government agencies and more. You will meet—
- Executives (CEOs, CTOs, VPs)
- Startup founders
- Engineers, integrators, and designers
- Product managers
- Leading industry analysts
- Business development professionals
- Academicians
- Government professionals
- Media and trade associations
- Students
- And more!
FLEX EXECUTIVE PLANNING COMMITTEE
We appreciate the time, dedication, and expertise these leaders put into creating a valuable industry event.
CHAIR
- Bob Praino, CHASM Advanced Materials
ADVISORS
- Dylan Shah, Arieca
- Chris Bailey, Arizona State University
- Stephaney Shanks, AV
- Benson Chan, Binghamton University
- Mark Poliks, Binghamton University
- Dan Slep, ChemCubed
- Carolyn Ellinger, Eastman Kodak
- Michael McCreary, E ink
- Christine Kallmayer, Fraunhofer – IZM
- Felippe Pavinatto, GE Aerospace
- Benyamin Davaji, PhD, Northeastern University
- Douglas Kiehl, Purdue University
- Simon Dodd, STMicroelectronics
- Andres Bujanda, US Army Research Laboratory
QUESTIONS?
Become a Solution Provider | Sponsorships | Marketing Opportunities
Tim Janes—Account Manager
[email protected]
General Questions:
[email protected]
Program Questions:
Agnes Cobar—Director, Programs & Committees
[email protected]