Optimization of Inkjet Printing for FHEs

Work being done to improve the resolution and reliability of inkjet printing for prototyping and volume manufacturing of flexible hybrid electronics as part of NextFlex Project Call 5.1 will be presented. Various combinations of inks and substrates are being evaluated, including particle-based and reactive silver inks and both low- and high-contact-angle substrates. Optimized printing processes are being developed for each using high-throughput printheads. Results on the cross-section profile, conductivity, adhesion, orientation-dependence, and yield of the resulting printed traces will be presented for the various ink-substrate-process parameter combinations. Key accomplishments include printing of low-resistance traces with width below 70 microns and printing of very narrow traces with width below 30 microns in some cases. Multilayer printing of conductors and dielectrics will also be presented, as will a combination of inkjet printing and nanoimprint lithography for even narrower traces.