HP 3D Printing of Electronics Using Multi Jet Fusion

HP Labs has been exploring and developing a 3D Printed Electronics approach based upon HP's commercial 3D Print technology, Multi Jet Fusion (MJF). During this talk, I will elaborate upon the 3D print method used for creating high conductivity traces, vias, and contact pads anywhere within a 3D printed part. This approach takes advantage of many of the attributes of MJF, like utilizing multiple fluids during printing and printing multiple parts at the same time, creating parts at high print speeds with final part strengths similar to MJF. I will also cover the fabrication of active devices, like a strain gauge and USB light device, as well as present on printing of resistors and cover efforts on post-print processing for further performance optimizations.