KEYNOTE: Flex PCB Manufacturing Method by Additive Manufacturing Using Inkjet Technology and Its Application

4:00 pm - 4:30 pm

Elephantech is a company that has been mass-producing flex PCB by additive manufacturing since 2018. We will introduce our Pure Additive processing, a method of inkjet printing of AgNPs as a seed layer, and electroless copper plating to complete the circuit. As an example of application, we will introduce a 3D circuit technology called IMPC, which is a combination of PET substrate and injection molding technology, which is a merit of the AM process and allows for a wider selection of substrates. Finally, we will discuss the difficulties in the development of the manufacturing process using the inkjet method and suggest how we can solve the problems.

Keynote

Masaaki Sugimoto

Co-founder & SVP, Board Member Elephantech

He is M.S., Earth and Planetary Science, Graduate School of Science, the University of Tokyo. He completed coursework without obtaining a degree, doctorate program, Graduate School of System Design and Management, Keio University. In January 2014, he co-founded Elephantech Inc (Former AgIC Inc.) and became Board Member and Vice President. At SXSW, where Elephantech launched its Kickstarter at its inception, he hosted a session in 2016 called "Weird Startups from Japanese Universities". He spent his time at the university researching hot springs and the environment for innovation. He currently serves as the executive in charge of Elephantech Additive Manufacturing Center.