Flexible Hybrid Electronics and Printed Sensors for Healthcare and Logistics Applications
Our research organization is developing Flexible Hybrid Electronics (FHE) systems, which employ silicon-based LSI die for signal processing and wireless communication circuitry, and are integrated onto low-cost, flexible plastic film substrates. We have also developed printed pressure sensors based on ferroelectric polymers for detecting human vital signs such as pulse waves. Printed temperature sensors based on PEDOT:PSS, which possesses high sensitivity and excellent durability, have also been developed. We have developed and fabricated advanced biosensors and gas/ environmental sensors by employing an enzyme reaction to detect the disease-related target molecules. The silver interconnects, antennas, and sensors were printed on the flexible substrate by screen printing and dispensing, then integrated with several components, including a thin battery mounted on the same substrate. We have also successfully fabricated complex multilayer patterns with features of L/S=200 µm. The printed interconnects layer thickness and sheet resistance were about 15µm and about 20 mΩ/□, respectively. The Si-LSI and other components were mounted at 170˚C for 2 min by using a low-temperature solder paste. Both Near Field Communication (NFC) and Bluetooth Low Energy (BLE) protocols were employed for wireless communication. Our ultimate goal is to develop smart sensor systems that apply to healthcare, medical and logistics applications. A flexible E-paper display was combined on the same substrate for logistics applications to show the necessary information for delivery persons and consumers.