Atmospheric Plasma Treatment of Dielectric Materials for Improved Interfacial Adhesive Strength and Durability

As the potential applications for printed electronics expand to more dynamic and extreme environments that include high velocity, high acceleration, and high temperatures, conventional polymeric substrate materials, and conductive trace materials may not maintain the structural or electronic properties for reliable use and design. As novel, higher-temperature materials are designed and utilized for printed electronics applications, the properties of the dielectric/conductive interface will become increasingly important to the performance and survivability of the components. This investigation seeks to evaluate the effect of surface functionalization via atmospheric plasma exposure on the adhesive strength of the dielectric/conductive material interface. In this study, we will be mechanically testing 3D printable materials for 5-axis extrusion printing. Traces, substrates, and adhesives will be explored that are suited for integrated 3D printed circuit boards or smart structures. These materials will be shock tested and compared with plasma-treated sets to measure the improvement in adhesion between materials and layers. Chemical changes on the surfaces due to plasma exposure will be evaluated using x-ray photoelectron spectroscopy (XPS) and water contact angle measurements.