[DEMO] UCLA: The Center for Heterogeneous Integration and Performance Scaling (CHIPS) Group Demonstrates its Flexible Work and Academic Capabilities

We at the UCLA’s Center for Heterogeneous Integration and Performance Scaling (CHIPS) Group would like to demonstrate the flexible products that we have developed on our FlexTrate platformTM. FlexTrateTM is based on a dielet-first flexible Fan-Out Wafer-Level Packaging (FOWLP) approach where we use Polydimethylsiloxane (PDMS) as a molding compound to embed the heterogeneous dielets and integrate them with mechanically robust vertically corrugated interconnects at 20-40 µm pad pitches without the use of solder. We have demonstrated FlexTrateTM to be reliably bendable to 1 mm bending radius for over 1000s of bending cycles and foldable without degradation in the systems electrical performance. Moreover, on our FlexTrateTM platform, we will demonstrate 200 dies integrated at 40 µm pad pitch, a Wireless Power Transfer (WPT) system, fully flexible and wireless 8-bipolar channels solderless surface electromyography (sEMG) system, and a foldable display. We will also demonstrate the state-of-the-art research facilities of UCLA California NanoSystem Institute (CNSI). CNSI is equipped with shared core research laboratories including the Electron Imaging Center of Nanomachines, Advanced Light Microscopy/Spectroscopy, Nano and Pico Characterization, Coherent Imaging, Quantum Information Research, Class 100 and Class 1,000 cleanrooms (including 2 Class 1,000 clean rooms dedicated to nano-bio research), the Macro-Scale Small Animal Imaging Facility, and Molecular Screening Shared Resource is specifically engineered space for low noise and low vibration to house sophisticated equipment such as SEM, TEM,, AFM, and e-Beam Writer. CNSI labs and equipment are available to corporate and academic partners.