FLEX Funding Opportunities
Tuesday, July 9th, 4:30-5:30pm
FLEX is the annual premier industry event focused on flexible hybrid electronics (FHE), hybrid electronics, printed electronics and advanced packaging innovations. FLEX Conference will introduce new ways of combining solid state devices and system interconnection through heterogeneous integration and advanced packaging. FLEX Conference & Exhibition is integrated with SEMICON West in San Francisco, CA.
A major program feature is the FLEX Funding Opportunities Session. Since 1993, these consortia have funded over 350 projects in R&D and Manufacturing, with a total public/private investment of more than U.S. $400 million. FlexTech, NBMC and NextFlex solicit proposals from academia and industry for candidate projects that may receive funding.
This session is designed to share future funding opportunities, provide history and context and connect interested organizations with one another, so that they can build a team to bid and work on industry and government funded projects together.
This session offers plenty of opportunity to ask questions, make connections and inspire new business opportunities.
Funding Opportunity Session—Tuesday, July 9th, 4:30-5:30pm
Welcome Remarks
4:30pm
Melissa Grupen-Shemansky, CTO & VP of Technology Communities, SEMI
Overview of the FlexTech & NBMC R&D Programs
4:35pm
Gity Samadi, Sr. Director, SEMI
Share highlights of the key funding topics, challenges, gap analysis and past projects and collaboration opportunities.
Overview of the NextFlex Manufacturing Program
4:55pm
Scott Miller, Director of Technology, NextFlex
Share highlights of the key funding topics, challenges, gap analysis and past projects and collaboration opportunities.
Other Funding Opportunities
5:10pm
Melissa Grupen-Shemansky, CTO & VP of Technology Communities, SEMI
Networking and Connecting to Projects
5:15pm