Takafumi Fukushima

Takafumi Fukushima received the PhD degrees in the Department of Materials Science and Chemical Engineering from Yokohama National University in 2003. His research activity from 2004 includes 3D and heterogeneous system integration using TSV (through-silicon via) and capillary self-assembly in Tohoku University as an assistant professor and associate professor. From 2016 to 2017, He was a visiting research associate at the Center for Heterogeneous Integration and Performance Scaling (CHIPS), Electrical Engineering Department, UCLA. He is currently working on 3D/hybrid/flexible integration technologies for wearable/healthcare devices at the Department of Mechanical Systems Engineering, Tohoku University, as an associate professor. He is a senior member of IEEE.