Sustainment in Electronics – Leveraging Future 3D Hybrid Electronics Manufacturing for Munitions Applications
Eric Forsythe 1; James Zunino 2, Vincent Matrisciano 3, Giorgio Bazzan 4, Mark Gordon 5
- US Army Combat Capabilities Development Command Army Research Laboratory, Adelphi MD 20783
- U.S. Army Combat Capabilities Development Command Armaments Centers
- Joint Program Executive Office Armaments and Ammunition
- Air Force Research Laboratory, Dayton OH
- Mfg Strategy, Inc, Tampa FL
The Department of Defense platforms depends on electronics to perform in environments that often exceed commercial and automotive electronics environmental reliability standards. Such harsh environments include; temperature, gravitational forces (g-forces), humidity, and radiation. These electronic systems must meet reliability standard such as IPC 6031A standards for thermal and electrical stressing and other similar electronics standards from the SEMI Standards consortium. The sustainment and reliability of DoD platforms are critical considerations for all DoD technologies to meet acquisition requirements. The supply chain and manufacturing availability is an important component for the sustainment of DoD technologies. Often, these DoD platforms depend on components that are obsolete requiring novel approaches to meet manufacturing and reliability testing standards for the sustainment of the platform. The following presentation will review the US Army Sustainment mission, how sustainment is enabled by DoD, and the critical requirements. The presentation will address the sustainment mission using munitions as an example platform. The presentation will include an introduction to sustainment centers; Army Depots and Air Force Air Logistics Centers. The presentation will tie together the sustainment requirements, in context with munitions, sustainment center manufacturing requirements, and the opportunity space for flexible hybrid electronics to impact the DoD Sustainment Mission.
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